Ceva has recently unveiled the Ceva-Waves Links200 multi-protocol platform IP with support for Bluetooth LE High Data Throughput (HDT) technology up to 7.5 Mbps and IEEE 802.15.4 for Zigbee, Thread, and Matter designed for TSMC’s low-power 12nm process. Released in 2016, Bluetooth 5 upgraded Low Energy implementation with four times the range and twice the speed of Bluetooth 4.0 LE transmission which meant up to 2 Mbps over BLE, and even the latest Bluetooth 6.0 specification does not change that. There’s just a new LE 2M 2BT physical layer for Bluetooth Channel Sounding. So I was intrigued when the press release of the Links200 further read: Addressing the rising market demand for faster, more efficient Bluetooth connectivity, particularly for low-power audio and latency-sensitive IoT applications, the breakthrough High Data Throughput mode more than doubles the speed of traditional Bluetooth, delivering a data rate of up to 7.5 Mbps. For this [...]
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